crwdns2933423:0crwdne2933423:0

Desoldering & Soldering of iPhone X PMU

crwdns2936315:0crwdne2936315:0
crwdns2936321:0crwdne2936321:0
crwdns2931653:03crwdne2931653:0
Desoldering & Soldering of iPhone X PMU: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 Desoldering & Soldering of iPhone X PMU: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 Desoldering & Soldering of iPhone X PMU: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0
  • Next, let's clean the bonding pad. Apply some mid-temperature Solder Paste to the bonding pad. Heat with Hot Air Gun at 280℃. Meantime, clean the bonding pad with Soldering Iron at 360℃.

  • Continue to clean the bonding pad with rosin soaked Solder Wick. Clean with PCB Cleaner afterwards. Tips: bonding pads of those empty pins might get knocked off the board when cleaning the bonding pad, which is normal. We can just leave them alone .

crwdns2935429:0crwdne2935429:0

crwdns2935429:0crwdne2935429:0

crwdns2944171:0crwdnd2944171:0crwdnd2944171:0crwdnd2944171:0crwdne2944171:0