Attach the logic board to the holder. Apply some Paste Flux on the USB IC. Heat the USB IC with Hot Air Gun at 340 °C and airflow 3. Nudge the USB IC with tweezers while heating. Take out the USB IC if it becomes loose.

Remove tin on the bonding pad with Soldering Iron at 365 °C and Hot Air Gun at 340 °C. Clean tin on the bonding pad again with solder wick.