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Fiio M6 Teardown

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  • Back view of the device, The part as identified:

  • ES9018Q2C DAC

  • ICN6211 MIPI LCD controller

  • Exynos 7270, this is a highly integrated chip for wearables, It includes the normal Samsung SOC characteristics, with stacked DRAM & eMMC integrated into the package. That is why the PCB don't have any DRAM or storage chips around.

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