Attach the signal board to the Reballing Platform. Put the reballing stencil in position to make sure that it is pressing against the signal board.

To prevent the solder paste from flowing into the motherboard gap, insert a metal plate.

Apply a layer of low-temperature Solder Paste and wipe off excess solder paste with a Lint-free Wipe. Remove the reballing stencil. Check if solder paste on the signal board is full.