crwdns2933423:0crwdne2933423:0

iPhone X-12 Double-stacked Board Separation & Recombination Tips

crwdns2936315:0crwdne2936315:0
crwdns2936325:0crwdne2936325:0
crwdns2931653:02crwdne2931653:0
iPhone X-12 Double-stacked Board Separation & Recombination Tips: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone X-12 Double-stacked Board Separation & Recombination Tips: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0
  • The logic board and middle layer are soldered with low-temperature solder paste. So the best temperature for the heating platform will be 155 °C-165 °C.

  • Push the logic board gently with tweezers when the temperature reaches 165 °C. If the logic board is loose, the tin has melted.

crwdns2935429:0crwdne2935429:0

crwdns2935429:0crwdne2935429:0

crwdns2944171:0crwdnd2944171:0crwdnd2944171:0crwdnd2944171:0crwdne2944171:0