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Xiaomi Mi 11 Teardown

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Xiaomi Mi 11 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Xiaomi Mi 11 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0
  • And on the even darker rear side, a huge expanse of copper conceals these tiny bits of silicon:

  • Qualcomm SM8350 Snapdragon 888 (5 nm) with integrated X60 modem, layered underneath Samsung K3LK7K70BM-BGCP 16 Gb LPDDR5 3200MHz

  • SK Hynix HN8T05BZGK 128GB flash memory chip UFS 3.1

  • Wi-Fi/BT 5.2 WCN 6851 Wi-Fi 6 wireless combo SoC

  • Qualcomm SDR868-RF transceiver chip

  • Qualcomm SMB1396 fast charging chip

  • Nuvolta NU1619A wireless power receiving chip

  • Qorvo QM77033D front-end module

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