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Xiaomi Mi 11の分解

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Xiaomi Mi 11 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Xiaomi Mi 11 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0
  • And on the even darker rear side, a huge expanse of copper conceals these tiny bits of silicon:

  • Qualcomm SM8350 Snapdragon 888 (5 nm) with integrated X60 modem, layered underneath Samsung K3LK7K70BM-BGCP 16 Gb LPDDR5 3200MHz

  • SK Hynix HN8T05BZGK 128GB flash memory chip UFS 3.1

  • Wi-Fi/BT 5.2 WCN 6851 Wi-Fi 6 wireless combo SoC

  • Qualcomm SDR868-RF transceiver chip

  • Qualcomm SMB1396 fast charging chip

  • Nuvolta NU1619A wireless power receiving chip

  • Qorvo QM77033D front-end module

そして、さらに暗い背面では、銅色が巨大な広がりとなってこれらの小さなシリコン片を隠しています。

Qualcomm SM8350 Snapdragon 888 (5 nm) with integrated X60 modemは、Samsung K3LK7K70BM-BGCP 16 Gb LPDDR5 3200MHzの下に配置されています。

SK Hynix HN8T05BZGK 128GB flash memory chip UFS 3.1

Wi-Fi/BT 5.2 WCN 6851 Wi-Fi 6 wireless combo SoC

Qualcomm SDR868-RF transceiver chip

Qualcomm SMB1396 fast charging chip

Nuvolta NU1619A wireless power receiving chip

Qorvo QM77033D front-end module

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