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Sustitución del IC de Carga Inalámbrica del iPhone X

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iPhone X Wireless Charging IC Replacement: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 iPhone X Wireless Charging IC Replacement: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 iPhone X Wireless Charging IC Replacement: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0

  • The first thing we do is to separate the upper layer from the lower layer. Place the motherboard on the heating platform and fit a screw into the screw hole on the motherboard. So we can take down the upper layer efficiently afterward.

  • Heat the motherboard for 2 minutes on the heating platform at 165℃.

  • After heating, take down the upper layer with tweezers and then the lower layer.

Lo primero que hacemos es separar la capa superior de la capa inferior. Coloca la placa base en la plataforma de calentamiento y coloca un tornillo en el orificio para tornillos de la placa base. Entonces podremos quitar la capa superior.

Calienta la placa base durante 2 minutos en la plataforma de calentamiento a 165 ℃.

Después de calentar, desmonta la capa superior con pinzas y luego la capa inferior.

[* black] The first thing we do is to separate the upper layer from the lower layer. Place the motherboard on the heating platform and fit a screw into the screw hole on the motherboard. So we can take down the upper layer efficiently afterward.
[* black] Heat the motherboard for 2 minutes on the heating platform at 165℃.
-[* black] After heating, take down the upper layer with tweezers and then the lower layer.
+[* black] After heating, take down the upper layer with [product|IF145-020|tweezers] and then the lower layer.

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