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PlayStation 5 拆解

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PlayStation 5 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 PlayStation 5 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 PlayStation 5 Teardown: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0
  • Did somebody tell Sony that we love screws? Because this steel plate is secured with a ton of screws. Um, thanks!

  • Underneath: a heat pipe for cooling a row of VRMs, connected to a baby fin stack. Looks like we're seeing the back of the main board here—all the really serious cooling hardware is mounted down below.

  • We may be approaching a point of no return, but let's un-mount the hardware and flip the board out.

  • Yep, that shiny stuff covering the processor is none other than mimetic polyalloy liquid metal, the king of high-performance thermal interface material.

  • Liquid metal is popular amongst PC modders and overclockers because it's an extremely efficient conductor of heat—significantly more efficient than conventional thermal pastes and putties. Translation? Cool chip run faster, make prettier graphic.

  • But with that thermal conductivity comes some unwanted electrical conductivity—so you don't want it sloshing around in the wrong place.

  • Sony filed a patent for an insulated, foam-cushioned pouch that keeps their liquid metal confined to the surface of the chip ... as long as you don't do what we're doing here.

是哪位大神告诉索尼我们喜欢螺丝的?看看这钢板上密密麻麻的螺丝。真是太谢谢您了。

下方:一条热管,用于冷却一排VRM,并连接到一个小鳍片上。从这里我们好像可以看到主板的背面,所有真正起作用的散热模组都在主板下面

我们可能已经无从下手了,但是让我们卸下硬件并翻转电路板。

果不其然,覆盖处理器的发亮的东西不过是高性能热界面材料之王——模拟合金液态金属。

液态金属在PC改造玩家和超频玩家中很流行,因为它是一种非常高效的导热体,比传统的导热膏和硅脂的热传递系数高得多。说人话?就是冷的芯片运行速度更快,永远更好的图形性能。

但是随着热导率的增加,会产生导电的风险,因此你绝对不希望它流动到主板的其他地方。

索尼已申请了一种隔热,泡沫缓冲框架的专利,该框架可将其液态金属限制在芯片表面上...只要您别模仿我们现在正在干的事就行。

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