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iPhone 12 和 12 Pro 拆解

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iPhone 12 and 12 Pro Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 12 and 12 Pro Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0
  • A little heat (a lot of heat) and a little prying yields two boards for the price of one! We split one of the iPhone 12 boards open to get a look at all that sweet silicon, and if it seems hard to guess which one, you're not alone—the logic boards of the 12 and 12 Pro are nearly identical, apart from a few serial numbers.

  • Apple APL1W01 A14 Bionic SoC, layered under Micron D9XMR MT53D512M64D4UA-046 XT:F 4 GB LPDDR4 SDRAM (6 GB RAM on the 12 Pro)

  • KICM224AY4402TWNA12029, 64 GB of Kioxia NAND flash memory.

  • Qualcomm SDR865 5G and LTE transceiver

  • Qualcomm SDX55M 5G modem-RF system and SMR526 intermediate frequency IC

  • USI/Apple U1 ultra-wideband chip

  • Avago AFEM-8200 high/mid power amplifier with integrated duplexer

  • Apple APL1094 343S00437 power management IC

一点热量(大量热量)和轻轻分离就可以获得两块主板!我们将其中一个iPhone 12主板分开以查看所有的芯片,并且,如果你猜不出来是12的主板还是12 Pro的,那你并不孤单——12和12 Pro的主板几乎相同,除了序列号。

苹果(Apple)APL1W01 A14仿生SoC,位于镁光(Micron)D9XMR MT53D512M64D4UA-046 XT:F 4 GB LPDDR4 SDRAM(12 Pro上为6 GB RAM)运存之下

KICM224AY4402TWNA12029,64 GB的铠侠(Kioxia)NAND闪存。

高通(Qualcomm)SDR865 5G和LTE收发器

高通(Qualcomm)SDX55M 5G调制解调器-射频系统和SMR526中频IC

环旭电子(USI)/苹果(Apple)U1超宽带芯片

安华高(Avago)AFEM-8200 集成双工器的高/中功率放大器

苹果(Apple)APL109 4343S00437 电源管理芯片

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