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Jump-wiring The MOSFET
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Grind the MOSFET here with a grinding tool. Then heat with Hot Air Gun to take down the dot projector module. Continue heating with the Hot Air Gun. Clean residual parts of the MOSFET with tweezers.
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Continue to apply some medium-temp solder paste to the bonding pad. Tin the bonding pad with Soldering Iron. Here we need 0.02mm Enameled Copper Wire. Heat with Soldering Iron. Connect Pin 2 and Pin 3 of the MOSFET with the wire.
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