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Demontage van de Samsung Galaxy Watch3

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Samsung Galaxy Watch3 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 Samsung Galaxy Watch3 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 Samsung Galaxy Watch3 Teardown: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0

  • Scooping out this vaguely disc-shaped motherboard next, we peek under the shields and find:

  • A Samsung SiP FO-PLP combining the Exynos 9110 dual-core, 1.15 GHz Cortex-A53 processor, their in-house 1 GB DRAM and Power Management IC

  • The SiP FO-PLP stands for System-in-Package Fan-Out Panel Level Packaging and is Samsung’s take on getting as much tech in the tiniest package—which was already used in the original Galaxy Watch.

  • Samsung Shannon 915 Intermediate Frequency IC

  • NXP PN80T NFC controller w/ Secure Element

  • Broadcom BCM430132 WiFi/Bluetooth module and Broadcom GNSS Location Hub for GPS/GLONASS/etc

  • Qualcomm Atheros QPA5580 Power Amplifier (likely)

  • IDT P9222S wireless power receiver

Nadat we dit vaag gevormde, cd-achtige moederbord uit het toestel weten te krijgen, kunnen we onder de plaatjes kijken en vinden we het volgende:

Een Samsung SiP FO-PLP die de Exynos 9110 dual-core, de 1.15 GHz Cortex-A53 processor, de in-house 1 GB DRAM en de powermanagement-IC combineert.

De SiP FO-PLP staat voor System-in-Package Fan-Out Panel Level Packaging en belichaamt, met andere woorden, Samsung's poging om zo veel mogelijk technische snufjes in het kleinst mogelijke pakketje te duwen—en welke ook al in de originele Galaxy Watch werd gebruikt.

S915 SBN3K Intermediate Frequency IC

NXP 80T17 NFC-controller

Broadcom BCM430132 WiFi/Bluetooth-module en Broadcom GNSS Location Hub voor GPS/GLONASS/etc

Qualcomm Atheros QPA5580

IDT P9222S draadloze powerontvanger

[* black] Scooping out this vaguely disc-shaped motherboard next, we peek under the shields and find:
[* red] A Samsung SiP FO-PLP combining the Exynos 9110 dual-core, 1.15 GHz Cortex-A53 processor, their in-house 1 GB DRAM and Power Management IC
[* icon_note] The SiP FO-PLP stands for System-in-Package Fan-Out Panel Level Packaging and is Samsung’s take on [https://www.systemplus.fr/foplp-vs-fowlp-the-battle-between-two-giants-samsung-and-tsmc/|getting as much tech in the tiniest package|new_window=true]—which was already used in the original Galaxy Watch.
- [* orange] S915 SBN3K Intermediate Frequency IC
- [* yellow] NXP 80T17 NFC controller
+ [* orange] Samsung Shannon 915 Intermediate Frequency IC
+ [* yellow] NXP [link|https://media.nxp.com/news-releases/news-release-details/nxp-takes-broad-leadership-security-and-nfc-deliver-new-secure?ID=2249487&c=254228&p=irol-newsArticle|PN80T] NFC controller w/ Secure Element
[* green] [https://www.broadcom.com/products/wireless/wireless-lan-bluetooth/bcm4313|Broadcom BCM430132|new_window=true] WiFi/Bluetooth module and [https://www.broadcom.com/products/wireless/gnss-gps-socs/bcm47755|Broadcom GNSS Location Hub|new_window=true] for GPS/GLONASS/etc
- [* light_blue] Qualcomm Atheros QPA5580
+ [* light_blue] Qualcomm Atheros QPA5580 Power Amplifier (likely)
[* blue] IDT P9222S wireless power receiver

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