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Vue éclatée de la Samsung Watch3

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Samsung Galaxy Watch3 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 Samsung Galaxy Watch3 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 Samsung Galaxy Watch3 Teardown: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0

  • Scooping out this vaguely disc-shaped motherboard next, we peek under the shields and find:

  • A Samsung SiP FO-PLP combining the Exynos 9110 dual-core, 1.15 GHz Cortex-A53 processor, their in-house 1 GB DRAM and Power Management IC

  • The SiP FO-PLP stands for System-in-Package Fan-Out Panel Level Packaging and is Samsung’s take on getting as much tech in the tiniest package—which was already used in the original Galaxy Watch.

  • Samsung Shannon 915 Intermediate Frequency IC

  • NXP PN80T NFC controller w/ Secure Element

  • Broadcom BCM430132 WiFi/Bluetooth module and Broadcom GNSS Location Hub for GPS/GLONASS/etc

  • Qualcomm Atheros QPA5580 Power Amplifier (likely)

  • IDT P9222S wireless power receiver

Nous retirons cette carte mère dont la forme rappelle vaguement un disque et jetons un coup d'œil sous les blindages pour trouver les éléments suivants :

Samsungs SiP FO-PLP qui associée processeur Exynos 9110 dual-core, 1.15 GHz Cortex-A53, leur propre DRAM et une CI de gestion d'énergie

Le SiP FO-PLP signifie" System-in-Package Fan-Out Panel Level Packaging", et c'est la solution de Samsung pour entasser un maximum de technologie dans un package minuscule.

CI de fréquence intermédiaire S915 SBN3K

Contrôleur NFC NXP 80T17

Module WiFi/Bluetooth Broadcom BCM430132 et Broadcom GNSS Location Hub pour GPS/GLONASS/etc

Qualcomm Atheros QPA5580

Récepteur d'énergie sans fil IDT P9222S

[* black] Scooping out this vaguely disc-shaped motherboard next, we peek under the shields and find:
[* red] A Samsung SiP FO-PLP combining the Exynos 9110 dual-core, 1.15 GHz Cortex-A53 processor, their in-house 1 GB DRAM and Power Management IC
[* icon_note] The SiP FO-PLP stands for System-in-Package Fan-Out Panel Level Packaging and is Samsung’s take on [https://www.systemplus.fr/foplp-vs-fowlp-the-battle-between-two-giants-samsung-and-tsmc/|getting as much tech in the tiniest package|new_window=true]—which was already used in the original Galaxy Watch.
- [* orange] S915 SBN3K Intermediate Frequency IC
- [* yellow] NXP 80T17 NFC controller
+ [* orange] Samsung Shannon 915 Intermediate Frequency IC
+ [* yellow] NXP [link|https://media.nxp.com/news-releases/news-release-details/nxp-takes-broad-leadership-security-and-nfc-deliver-new-secure?ID=2249487&c=254228&p=irol-newsArticle|PN80T] NFC controller w/ Secure Element
[* green] [https://www.broadcom.com/products/wireless/wireless-lan-bluetooth/bcm4313|Broadcom BCM430132|new_window=true] WiFi/Bluetooth module and [https://www.broadcom.com/products/wireless/gnss-gps-socs/bcm47755|Broadcom GNSS Location Hub|new_window=true] for GPS/GLONASS/etc
- [* light_blue] Qualcomm Atheros QPA5580
+ [* light_blue] Qualcomm Atheros QPA5580 Power Amplifier (likely)
[* blue] IDT P9222S wireless power receiver

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