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Desmontaje del Samsung Galaxy Watch3

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Samsung Galaxy Watch3 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 Samsung Galaxy Watch3 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 Samsung Galaxy Watch3 Teardown: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0

  • Scooping out this vaguely disc-shaped motherboard next, we peek under the shields and find:

  • A Samsung SiP FO-PLP combining the Exynos 9110 dual-core, 1.15 GHz Cortex-A53 processor, their in-house 1 GB DRAM and Power Management IC

  • The SiP FO-PLP stands for System-in-Package Fan-Out Panel Level Packaging and is Samsung’s take on getting as much tech in the tiniest package—which was already used in the original Galaxy Watch.

  • Samsung Shannon 915 Intermediate Frequency IC

  • NXP PN80T NFC controller w/ Secure Element

  • Broadcom BCM430132 WiFi/Bluetooth module and Broadcom GNSS Location Hub for GPS/GLONASS/etc

  • Qualcomm Atheros QPA5580 Power Amplifier (likely)

  • IDT P9222S wireless power receiver

Al sacar esta placa madre con forma de disco, miramos bajo los escudos y encontramos..:

El SiP FO-PLP de Samsung combina el procesador Cortex-A53 de 1.15 GHz de doble núcleo del Exynos 9110, su DRAM interna y el CI de gestión de energía.

El SiP FO-PLP significa System-in-Package Fan-Out Panel Level Packaging y es que Samsung se encarga de conseguir tanta tecnología en el paquete más pequeño. Esto ya se se utilizó en el Galaxy Watch original

CI de Frecuencia Intermedia S915 SBN3K

Controlador NFC S915 SBN3K

Módulo WiFi/Bluetooth Broadcom BCM430132 y Hub de localización Broadcom GNSS para GPS/GLONAS/etc

Qualcomm QPA5580

Receptor inalámbrico de energía IDT P9222S

[* black] Scooping out this vaguely disc-shaped motherboard next, we peek under the shields and find:
[* red] A Samsung SiP FO-PLP combining the Exynos 9110 dual-core, 1.15 GHz Cortex-A53 processor, their in-house 1 GB DRAM and Power Management IC
[* icon_note] The SiP FO-PLP stands for System-in-Package Fan-Out Panel Level Packaging and is Samsung’s take on [https://www.systemplus.fr/foplp-vs-fowlp-the-battle-between-two-giants-samsung-and-tsmc/|getting as much tech in the tiniest package|new_window=true]—which was already used in the original Galaxy Watch.
- [* orange] S915 SBN3K Intermediate Frequency IC
- [* yellow] NXP 80T17 NFC controller
+ [* orange] Samsung Shannon 915 Intermediate Frequency IC
+ [* yellow] NXP [link|https://media.nxp.com/news-releases/news-release-details/nxp-takes-broad-leadership-security-and-nfc-deliver-new-secure?ID=2249487&c=254228&p=irol-newsArticle|PN80T] NFC controller w/ Secure Element
[* green] [https://www.broadcom.com/products/wireless/wireless-lan-bluetooth/bcm4313|Broadcom BCM430132|new_window=true] WiFi/Bluetooth module and [https://www.broadcom.com/products/wireless/gnss-gps-socs/bcm47755|Broadcom GNSS Location Hub|new_window=true] for GPS/GLONASS/etc
- [* light_blue] Qualcomm QPA5580
+ [* light_blue] Qualcomm Atheros QPA5580 Power Amplifier (likely)
[* blue] IDT P9222S wireless power receiver

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