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Samsung Galaxy Z Flip の分解

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Samsung Galaxy Z Flip Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0

  • More chips inside this silicon sandwich include:

  • Qualcomm PM8150 power management IC

  • Qualcomm WCD9341 audio codec

  • Samsung S2MIW04 power management

  • Samsung S2DOS04 DC-DC converter (likely for the backlight)

  • Qualcomm QDM3870 RF front-end module

  • Samsung S2MPB02 power management IC

  • Likely a Texas Instruments TAS2562 audio amplifier

シリコンサンドイッチの内側には、さらに多くのチップが搭載されています。

Qualcomm PM8150パワーマネージメントICs

Qualcomm WCD9341 オーディオコディック IC

2MIWO4

Samsung S2DOS04 DC-DCコンバーター (バックライト用の可能性)

Qualcomm QDM3870 RFフロントエンドモジュール

Samsung S2MPB02パワーマネージメント IC

Likely a Texas Instruments TAS2xxx オーディオアンプ

[* black] More chips inside this silicon sandwich include:
[* red] Qualcomm PM8150 power management IC
[* orange] Qualcomm [link|https://www.qualcomm.com/products/wcd9341|WCD9341|new_window=true] audio codec
- [* yellow] 2MIWO4
+ [* yellow] Samsung S2MIW04 power management
[* green] Samsung S2DOS04 DC-DC converter (likely for the backlight)
[* light_blue] Qualcomm QDM3870 RF front-end module
[* blue] Samsung S2MPB02 power management IC
- [* violet] Likely a Texas Instruments TAS2xxx audio amplifier
+ [* violet] Likely a Texas Instruments [link|https://www.ti.com/product/TAS2562|TAS2562] audio amplifier

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