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Smontaggio Samsung Galaxy Z Flip

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Samsung Galaxy Z Flip Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0

  • More chips inside this silicon sandwich include:

  • Qualcomm PM8150 power management IC

  • Qualcomm WCD9341 audio codec

  • Samsung S2MIW04 power management

  • Samsung S2DOS04 DC-DC converter (likely for the backlight)

  • Qualcomm QDM3870 RF front-end module

  • Samsung S2MPB02 power management IC

  • Likely a Texas Instruments TAS2562 audio amplifier

Tra gli altri chip all'interno di questo panino di silicio ci sono:

Chip integrati di gestione alimentazione Qualcomm PM8150

IC codec audio Qualcomm WCD9341

2MIWO4

DOS04 09Y44E W1948 (probabilmente un IC per la retroilluminazione)

Modulo front-end RF Qualcomm QDM3870

[* black] More chips inside this silicon sandwich include:
- [* red] Qualcomm PM8150 power management ICs
- [* orange] Qualcomm WCD9341 audio codec IC
- [* yellow] 2MIWO4
- [* green] DOS04 09Y44E W1948 (likely a backlight IC)
+ [* red] Qualcomm PM8150 power management IC
+ [* orange] Qualcomm [link|https://www.qualcomm.com/products/wcd9341|WCD9341|new_window=true] audio codec
+ [* yellow] Samsung S2MIW04 power management
+ [* green] Samsung S2DOS04 DC-DC converter (likely for the backlight)
[* light_blue] Qualcomm QDM3870 RF front-end module
+ [* blue] Samsung S2MPB02 power management IC
+ [* violet] Likely a Texas Instruments [link|https://www.ti.com/product/TAS2562|TAS2562] audio amplifier

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