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iPhone 11 Pro Max 拆解

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iPhone 11 Pro Max Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 iPhone 11 Pro Max Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 iPhone 11 Pro Max Teardown: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0

  • Last but not least, top side we find:

  • Toshiba TSB 4226VE9461CHNA1 1927 64 GB flash storage

  • YY NEC 9M9 (likely accel/gyro)

  • In addition to all these chips, we tease apart several layers of graphite thermal transfer material backing the RF board.

  • Apple says its improved thermal design gives these iPhone Pros the "best sustained performance ever in an iPhone." That's accomplished by pulling heat from the logic board straight through several layers of graphite where it dissipates into the rear case.

  • This may not seem as fancy as the liquid cooling systems we've seen in some Android phones, but it certainly must be enough to keep the super-efficient A13 cool, while not interfering with any signals traveling to or from the RF board that it clings to.

最后，在顶上我们找到了：

东芝（Toshiba） TSB4226VE9461CHNA1 1927 64GB闪存。

YY NEC 9M9 （猜测是加速计/陀螺仪）

除了所有这些芯片，我们撕开了射频电路板背上的几层的石墨导热材料

苹果所言Pro版iPhone改进的散热设计，正是依靠从主板直接透过数层石墨将热量散到外壳上，使得这台手机成为“iPhone有史以来最强的持续工作性能的机器”。

虽然这样的设计看上去不像一些安卓手机上的液态散热系统那样强劲，但用在A13这样能效比暴高的SoC上足矣，而且好处是石墨不会阻碍紧贴着它的射频板收发任何的信号。

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