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Samsung Galaxy Fold Teardown

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Samsung Galaxy Fold Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Samsung Galaxy Fold Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • Main PCB IC ID, part 3:

  • ON Semiconductor FSA644 1.5 Gbps SPDT analog switch

  • ON Semiconductor FAN48618 1 A boost converter

  • Goertek MEMS microphone

  • STMicroelectronics LPS22HH pressure sensor

  • Likely OSRAM ambient light/proximity/color sensor with IR emitter

  • Seiko Instruments Hall Effect sensor

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