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Smontaggio Samsung Galaxy Note9

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Samsung Galaxy Note9 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Samsung Galaxy Note9 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • The chips that move the bits and bytes:

  • Samsung K3UH6H60AM-AGCJ 6 GB LPDDR4X SDRAM, with Qualcomm Snapdragon 845 layered underneath

  • Samsung KLUDG4U1EA-B0C1 128 GB eUFS storage

  • NXP Semiconductor PN80T NFC Controller

  • Skyworks SKY78160-51 Front-End Module WLAN

  • Avago/Broadcom AFEM-9096 Front-End Module LTE

  • Qualcomm WCD9341 Audio Codec

  • Maxim MAX77705 PMIC

Ecco i chip che muovono i bytes:

6 GB di memoria LPDDR4X Samsung K3UH6H60AM-AGCJ, con il processore Qualcomm Snapdragon 845 al piano sottostante

128 GB di memoria eUFS Samsung KLUDG4U1EA-B0C1

Controller NFC NXP 80T17

Modulo Front-End WLAN Skyworks SKY78160-51

Modulo Front-End LTE Avago/Broadcom AFEM-9096

Codec audio Qualcomm WCD9341

PMIC (chip gestione alimentazione) Maxim MAX77705

[* black] The chips that move the bits and bytes:
[* red] Samsung [https://www.samsung.com/semiconductor/dram/lpddr4x/K3UH6H60AM-AGCJ/|K3UH6H60AM-AGCJ|new_window=true] 6 GB LPDDR4X SDRAM, with [https://www.qualcomm.com/products/snapdragon-845-mobile-platform|Qualcomm Snapdragon 845|new_window=true] layered underneath
[* orange] Samsung [https://www.samsung.com/semiconductor/estorage/eufs/KLUDG4U1EA-B0C1/|KLUDG4U1EA-B0C1|new_window=true] 128 GB eUFS storage
- [* yellow] NXP 80T17 NFC Controller
+ [* yellow] NXP Semiconductor [link|https://media.nxp.com/news-releases/news-release-details/nxp-and-garmin-team-bring-secure-and-convenient-nfc-mobile|PN80T|new_window=true] NFC Controller
[* green] Skyworks [https://store.skyworksinc.com/ProductDetail/SKY7816051-Skyworks-Solutions-Inc/625141/|SKY78160-51|new_window=true] Front-End Module WLAN
[* light_blue] Avago/Broadcom AFEM-9096 Front-End Module LTE
[* blue] Qualcomm WCD9341 Audio Codec
[* violet] Maxim MAX77705 PMIC

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