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Samsung Galaxy J6拆解

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Samsung Galaxy J6 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Samsung Galaxy J6 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0
  • On the front of the motherboard, we find:

  • Samsung KLMBG2JETD-B041 32 GB NAND Flash Memory

  • Samsung K4EHE304EC-AGCF ? 3 GB Memory layered over the Exynos 7870 chip

  • And on the back, we have:

  • Samsung Shannon 515 power management IC

  • Samsung Shannon 925 RF Tranceiver

  • Skyworks Multiband Power Amplifier SKY77656-11

  • There are also two empty areas. Maybe the same board is used for different versions of the J6 that require a different complement of chips?

在主板的正面,我们能看见:

三星 KLMBG2JETD-B041 32 GB NAND 閃存

三星 3GB 内存分层在Exynos 7870芯片上

在背面,有这些:

S515 606FUU电源管理IC

中频 IC S925D2

Skyworx 77656-11多频带射频功率放大器

还有两个空白区域。 也许相同的电路板用于不同版本的J6,需要不同的芯片补充?

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