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HTC Vive Pro Teardown

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HTC Vive Pro Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 HTC Vive Pro Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 HTC Vive Pro Teardown: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0
  • Scan complete—chips identified:

  • Two Nordic Semiconductor NRF24LU1P Ultra Low Power 2.4 GHz RF SoC

  • Atmel SAM G55J 32-bit microcontroller

  • Two Winbond 25Q32JV1Q 4 MB flash memory

  • Alpha Imaging Technology AIT8589D—likely an updated version of the Image Signal Processor we saw in the first Vive

  • Lattice Semiconductor iCE40HX8K Ultra Low Power FPGA

  • TDK (formerly Invensense) MPU-6500 3-axis accelerometer/gyroscope

  • In the third image: A Triad Semiconductor TS4231 Light-to-Digital Converter IC nestles close to each IR sensor, ready to convert IR light pulses into digital signals.

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