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iPhone5 拆解

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iPhone 5 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0

  • Chips on a board. Kinda like ants on a log.

  • STMicroelectronics LIS331DLH (2233/DSH/GFGHA) ultra low-power, high performance, three-axis linear accelerometer

  • Texas Instruments 343S0628 touch screen SoC

  • Broadcom BCM5976 touchscreen controller

  • Rather than a single touchscreen controller, Apple went with a multi-chip solution to handle the larger screen size, à la iPad.

  • Apple A6 application processor

  • Qualcomm MDM9615M LTE modem

  • Qualcomm RTR8600 Multi-band/mode RF transceiver, the same one found in the Samsung Galaxy S III

主板上的芯片。有点像木头上的蚂蚁。

意法半导体（STMicroelectronics）LIS331DLH (2233/DSH/GFGHA)超低功耗、高性能三轴直线加速度计

德州仪器（Texas Instruments）343S0628触摸屏SoC

博通（Broadcom）BCM5976触摸屏控制器

苹果没有采用单一触摸屏控芯片，而是采用多芯片解决方案来处理更大的屏幕尺寸，就像iPad那样。

苹果（Apple）A6处理器

高通（Qualcomm）MDM9615M LTE 调制解调器

高通（Qualcomm）RTR8600 多频段/模式射频收发器，与三星Galaxy S III相同

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