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三星盖乐世S9拆解指南

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Samsung Galaxy S9 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0
  • Lets take a look at the chips that power all that fancy hardware:

  • Samsung K3UH5H5OMM-AGCJ 32 Gb (4 GB) LPDDR4X DRAM, layered over a Qualcomm Snapdragon 845

  • Toshiba THGAF8G9T43BAIR 64 GB UFS (NAND flash + controller)

  • Avago AFEM-9096 front end module

  • Qualcomm Aqstic WCD9341 audio codec

  • Maxim MAX77705F PMIC

  • Skyworks SKY13716-1 low band front end module

  • IDT P9320S wireless power receiver likely similar to the P9320

让我们看看为所有那些奇特硬件提供动力的芯片:

三星K3UH5H5-OMMAGCJ 32 Gb(4 GB)LPDDR4X内存,下方是高通骁龙 845

东芝THGAF8G9T43BAIR 64 GB UFS(NAND闪存+控制器)

安华高AFEM-9096

高通Aqstic WCD9341音频编解码器

美信MAX77705F电源管理集成电路

Skyworks 13716

IDT P9320S无线电力接收器可能类似于P9320

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