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Desmontaje del Samsung Galaxy S9

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Samsung Galaxy S9 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0

  • Lets take a look at the chips that power all that fancy hardware:

  • Samsung K3UH5H5OMM-AGCJ 32 Gb (4 GB) LPDDR4X DRAM, layered over a Qualcomm Snapdragon 845

  • Toshiba THGAF8G9T43BAIR 64 GB UFS (NAND flash + controller)

  • Avago AFEM-9096 front end module

  • Qualcomm Aqstic WCD9341 audio codec

  • Maxim MAX77705F PMIC

  • Skyworks SKY13716-1 low band front end module

  • IDT P9320S wireless power receiver likely similar to the P9320

Miremos a los chips que le dan potencia a todo ese elegante hardware:

Samsung K3UH5H5-OMMAGCJ 32 Gb (4 GB) LPDDR4X DRAM, sobre un Qualcomm Snapdragon 845

Toshiba THGAF8G9T43BAIR 64 GB UFS (NAND flash + controlador)

Módulo frontal Avago AFEM-9096

Qualcomm Aqstic WCD9341 audio codec

Maxim MAX77705F PMIC

Módulo frontal de banda baja Skyworks SKY13716-1

Receptor de potencia inalámbrico IDT P9320S muy similar al P9320

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