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Throw that mobo on the table and give it a spin! Side A has all the big hits:
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Samsung K3UH6H60AM-NGCJ LPDDR4X 6 GB DRAM, layered over a Qualcomm Snapdragon 845
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Toshiba THGAF4G9N4LBAIR 64 GB UFS (NAND flash + controller)
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Avago AFEM-9096 front end module
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Qualcomm Aqstic™ WCD9341 audio codec
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Maxim Integrated MAX77705F PMIC
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Qualcomm QET4100 envelope tracker
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Maxim MAX98512 audio amplifier
| [* black] Throw that mobo on the table and give it a spin! Side A has all the big hits: | |
| - | [* red] Samsung [http://www.samsung.com/semiconductor/dram/lpddr4x/K3UH6H60AM-NGCJ/| |
| + | [* red] Samsung [http://www.samsung.com/semiconductor/dram/lpddr4x/K3UH6H60AM-NGCJ/|K3UH6H60AM-NGCJ|new_window=true] LPDDR4X 6 GB DRAM, layered over a [https://www.qualcomm.com/products/snapdragon-845-mobile-platform|Qualcomm Snapdragon 845|new_window=true] |
| [* orange] Toshiba [https://toshiba.semicon-storage.com/eu/product/memory/nand-flash/mlc-nand/ufs.html|THGAF4G9N4LBAIR|new_window=true] 64 GB UFS (NAND flash + controller) | |
| - | [* yellow] |
| + | [* yellow] Avago AFEM-9096 front end module |
| [* green] Qualcomm Aqstic™ [https://www.qualcomm.com/solutions/mobile-computing/features/aqstic|WCD9341|new_window=true] audio codec | |
| - | [* light_blue] Maxim MAX77705F PMIC |
| - | [* blue] Qualcomm QET4100 envelope tracker |
| + | [* light_blue] Maxim Integrated MAX77705F PMIC |
| + | [* blue] Qualcomm [link|https://www.qualcomm.com/news/releases/2016/02/17/qualcomm-technologies-announces-next-generation-qualcomm-rf360-front-end|QET4100|new_window=true] envelope tracker |
| [* violet] Maxim MAX98512 audio amplifier |
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