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Desmontaje Samsung Galaxy S9+

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Samsung Galaxy S9+ Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Samsung Galaxy S9+ Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0
  • Throw that mobo on the table and give it a spin! Side A has all the big hits:

  • Samsung K3UH6H60AM-NGCJ LPDDR4X 6 GB DRAM, layered over a Qualcomm Snapdragon 845

  • Toshiba THGAF4G9N4LBAIR 64 GB UFS (NAND flash + controller)

  • Avago AFEM-9096 front end module

  • Qualcomm Aqstic™ WCD9341 audio codec

  • Maxim Integrated MAX77705F PMIC

  • Qualcomm QET4100 envelope tracker

  • Maxim MAX98512 audio amplifier

Tira esa placa madre sobre la mesa y pínchala. Lado A tiene todos los grandes éxitos:

Samsung K3UH6H6-NGCJLPDDR4X 6 GB DRAM sobre Qualcomm Snapdragon 845.

Toshiba THGAF4G9N4LBAIR 64 GB UFS (NAND flash + controlador)

AVAGO AFEM-9096 KM1746

Qualcomm Aqstic™ WCD9341 audio codec

Maxim MAX77705F PMIC

Rastreador envolvente Qualcomm QET4100

Amplificador de audio Maxim MAX98512

[* black] Throw that mobo on the table and give it a spin! Side A has all the big hits:
- [* red] Samsung [http://www.samsung.com/semiconductor/dram/lpddr4x/K3UH6H60AM-NGCJ/|K3UH6H6-NGCJ|new_window=true] LPDDR4X 6 GB DRAM, layered over a [https://www.qualcomm.com/products/snapdragon-845-mobile-platform|Qualcomm Snapdragon 845|new_window=true]
+ [* red] Samsung [http://www.samsung.com/semiconductor/dram/lpddr4x/K3UH6H60AM-NGCJ/|K3UH6H60AM-NGCJ|new_window=true] LPDDR4X 6 GB DRAM, layered over a [https://www.qualcomm.com/products/snapdragon-845-mobile-platform|Qualcomm Snapdragon 845|new_window=true]
[* orange] Toshiba [https://toshiba.semicon-storage.com/eu/product/memory/nand-flash/mlc-nand/ufs.html|THGAF4G9N4LBAIR|new_window=true] 64 GB UFS (NAND flash + controller)
- [* yellow] AVAGO AFEM-9096 KM1746
+ [* yellow] Avago AFEM-9096 front end module
[* green] Qualcomm Aqstic™ [https://www.qualcomm.com/solutions/mobile-computing/features/aqstic|WCD9341|new_window=true] audio codec
- [* light_blue] Maxim MAX77705F PMIC
- [* blue] Qualcomm QET4100 envelope tracker
+ [* light_blue] Maxim Integrated MAX77705F PMIC
+ [* blue] Qualcomm [link|https://www.qualcomm.com/news/releases/2016/02/17/qualcomm-technologies-announces-next-generation-qualcomm-rf360-front-end|QET4100|new_window=true] envelope tracker
[* violet] Maxim MAX98512 audio amplifier

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