Flip over the popped-off plate component. Use the soldering iron to burn off the adhesive glue protecting the innards of the device in this area

The soldering iron is extremely hot. Please be careful when using it

With the soldering iron, go in a circular path around the underside of the component where the glue binds it together (the white lining)

The component should pop off after using it (a spudger might be needed to get more leverage when popping it off)