crwdns2933805:0crwdne2933805:0
crwdns2933797:0Reina Godeckcrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Reina Godeck
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
| - | [* red] Apply a small amount of thermal compound, about the size of a grain of rice, to the edge of both the CPU and GPU. |
|---|---|
| - | [* black] Using a clean plastic card, carefully spread the thermal compound evenly over the surfaces of both processors. |
| - | [* icon_note] Once spread, the compound should be about as thick as a single sheet of paper. |
| - | [* icon_caution] Be careful not to apply too much or too little compound to both processors. Adding too much compound can effectively insulate the processor from the heatsink (no heat transfer), while adding too little can decrease heat transfer from the processor. |
| + | [* red] Apply a small amount of ***thermal compound***, about the size of a grain of rice, on the corner of each the cleaned contact plates. |
| + | [* black] Using a ***clean plastic card***, carefully spread the thermal compound evenly over the surfaces of each contact plate. |
| + | [* icon_caution] ''Avoid applying too much or too little thermal compound, as it can impede crucial heat transfer. Once spread, the compound should be about as thick as a single sheet of paper.'' |