crwdns2936637:0crwdne2936637:0 crwdns2853008:0crwdne2853008:0 crwdns2918746:0crwdne2918746:0

crwdns2933803:014crwdne2933803:0

crwdns2933797:0Kyle Wienscrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Kyle Wiens

crwdns2933769:0crwdne2933769:0
crwdns2933771:0crwdne2933771:0
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-[* black] How did Apple stack the two boards? They attached a thick PCB to the perimeter with integrated through-hole ground vias.
-[* black] Here, the A11 SoC lies nestled at the center of the main board. You can get a sense of the 3D structure of the board from the X-ray photos. Those cylinders around the edge are holes filled with solder that connect the two boards.
+[* black] How did Apple stack the two boards? They created a third spacer PCB that lines the perimeter. Instead of a fussy flex cable, data travels along dozens of through-hole vias.
+[* black] Here, the A11 SoC lies nestled at the center of the main board. You can get a sense of the 3D structure of the board from the X-ray photos. The cylinders around the edge are holes filled with solder connecting the two boards.