crwdns2933803:09crwdne2933803:0
crwdns2933797:0Jeff Suovanencrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Jeff Suovanen
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| [* black] How did Apple put even more tech in 70% of the footprint? By folding the board in half, of course. | |
| [* black] The two halves are soldered together, so we got some help from our hosts [https://www.circuitwise.com.au/|Circuitwise|new_window=true] and their BGA hot air rework station to separate the layers. | |
| [* black] With the pieces separated, we tallied the area of all of the separate layers, and added it up to 135% of the iPhone 8 Plus logic board's area. Way to go putting more into less, Apple. | |
| [* black] The iPhone X logic board is the first double-stacked board we've seen in an iPhone since the [guide|599|very first iPhone|stepid=3166|new_window=true] (third photo). | |
| - | [* icon_note] The downside of this clever design is that board-level |
| + | [* icon_note] The downside of this clever design is that many board-level repairs will be a lot more difficult. |