crwdns2933803:08crwdne2933803:0
crwdns2933797:0Jeff Suovanencrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Jeff Suovanen
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
| - | [* black] Warranty void stickers on the heat sink? That's odd, could that mean... |
|---|---|
| - | [* black] Yes! The CPU is modular! The non-soldered Kaby Lake rumors appear to hold true even for apple products. |
| + | [* black] This new heat sink design has us intrigued. What's hiding under there? |
| + | [* black] Warranty voiding stickers on the heat sink screws? That's odd. Could that mean... |
| + | [* black] Yes! The CPU is modular, too! It lifts right off with the heat sink, revealing a standard LGA 1151 CPU socket. |
| + | [* icon_reminder] Again, this isn't the most accessible thing in the world—it's flipped onto the backside of the logic board, trapped behind a lot of other components, and buried under a glued-down pane of glass—but for the first time in years it's ''possible'' to replace or upgrade the CPU without a reflow station, and that's a big win. |