crwdns2933423:0crwdne2933423:0

crwdns2933805:0crwdne2933805:0

crwdns2933797:0drwreckcrwdnd2933797:0crwdne2933797:0

crwdns2936047:0crwdne2936047:0

crwdns2933769:0crwdne2933769:0
crwdns2933771:0crwdne2933771:0
crwdns2933801:0crwdne2933801:0

crwdns2933807:0crwdne2933807:0

-[* black] Next up are the internals. The actual chips being used are very similar to the ones found on the G1 (teardown). Instead of the Qualcomm MSM7201A, it runs the MSM7200A. Included in this particular Qualcomm chipset is the PMIC, Qualcomm PM7540, and the RF transceiver, which we believe to be the Qualcomm MXU6219. Qualcomm transcievers are typically labelled with RTR, and we’re actually unsure what MXU stands for. But nonetheless, there’s no other IC big enough to be a transceiver.
-[* black] The X1 also uses a Micron NAND Flash + RAM MCP, sporting 256MB RAM and 512MB storage. The Bluetooth and Wi-Fi are run by TI with similar chips found on the G1, the BRF6350BL (G1 uses BRF6300C) and WL1251B (same as G1). The Wi-Fi is also managed by the same power amp, TI WL1251FE. Power amps, like the G1 are run by Avago for UMTS bands, and TriQuint for GSM bands.
+[* icon_reminder] The actual chips being used are very similar to the ones found on the G1.
+[* black] Instead of the Qualcomm MSM7201A, it runs the MSM7200A.
+[* black] Included in this particular Qualcomm chipset is the PMIC, Qualcomm PM7540, and the RF transceiver, which we believe to be the Qualcomm MXU6219.
+[* black] Micron NAND Flash + RAM MCP, sporting 256MB RAM and 512MB storage.
+[* black] The Bluetooth and Wi-Fi are run by TI, the BRF6350BL and WL1251B respectively.