crwdns2936039:0iBook G4 14" 1.42 GHz Heat Sink Replacementcrwdnd2936039:06crwdne2936039:0

crwdns2933803:06crwdne2933803:0

crwdns2933797:0Andrew Bookholtcrwdnd2933797:0Dzi 20, 2009crwdne2933797:0

	[* icon_note] It may be necessary to soften the thermal paste between the logic board and heat sink. You can soften the thermal compound using a hairdryer. Move the hairdryer back and forth over the ribbed metal section of the heat sink for one minute. At this point, the heat sink should come free easily.
	[* black] If necessary, use a spudger to pry up the heat sink from the left side near the hard drive.
	[* black] While lifting straight up on the hinge grill with your right hand, lift the heat sink with your left hand from the end nearest the hard drive and remove the heat sink assembly from the computer.
+	[* black] Most 14" iBooks use thermally conductive pads rather than thermal paste to conduct heat from the processors to the heat sink. In the highly unlikely event that these pads fall off or become unusable during heat sink reinstallation, be sure to apply a liberal amount of thermal paste to the surface of all processors before mounting the heat sink to avoid damage from overheating.