crwdns2936637:0crwdne2936637:0 crwdns2853008:0crwdne2853008:0 crwdns2918746:0crwdne2918746:0

crwdns2933803:012crwdne2933803:0

crwdns2933797:0Alex Leighcrwdnd2933797:0crwdne2933797:0

crwdns2936047:0crwdne2936047:0

crwdns2933769:0crwdne2933769:0
crwdns2933771:0crwdne2933771:0
crwdns2933801:0crwdne2933801:0

crwdns2933807:0crwdne2933807:0

[* black] Flipping both boards over reveals a lot of nothing on the smaller board, but a ton of chips on the motherboard—a "smörgås-board," if you will:
[* red] RFMD [http://www.rfmd.com/CS/Documents/SL_Eurasia%20RF6260_0109.pdf|RF6260] Quad-band Multimode Power Amplifier Module
- [* orange] Samsung KMVYL000LM Multichip Memory Package, which we believe to house 512 MB of RAM in addition to the main processor.
- [* yellow] Samsung [https://chipworks.secure.force.com/catalog/ProductDetails?sku=SAM-K3PE7E700M-XGC1&viewState=DetailView&cartID=&g=&parentCategory=&navigationStr=CatalogSearchInc&searchText=circuit|K3PE7E700M] 512 MB DDR2 SDRAM
+ [* orange] Samsung [http://www.abiresearch.com/research/1008693|KMVYL000LM] Multi-Chip Package, contains 16GB NAND Flash and 64MB SDRAM.
+ [* yellow] Samsung [http://www.samsung.com/us/business/oem-solutions/pdfs/PSG2011_web.pdf|K3PE7E700M-XGC1] 1GB LPDDR2 SDRAM, and TI [http://www.ti.com/general/docs/wtbu/wtbuproductcontent.tsp?templateId=6123&navigationId=12843&contentId=53243|OMAP 4460] SoC. Package-on-Package.
[* green] Samsung [http://www.abiresearch.com/research/1008688-Samsung%3A+SWB-B42+-+BCM4330+module+BT+4.0+dual+band+Wlan+FM+RxTx|SWB-B42] BT 4.0 Dual Band Wlan FM Tx/Rx. [http://www.chipworks.com/index.php|Chipworks] says the module is actually manufactured by Murata, and houses a Broadcom BCM4330 die inside.
[* blue] NXP [https://chipworks.secure.force.com/catalog/ProductDetails?sku=NXP-65N00|65N00] Smart Card IC. According to Chipworks, this two-die package houses an MCU and a PN544 NFC controller.
[* violet] Silicon Image [http://www.siliconimage.com/products/product.aspx?pid=169|9244] MHL transmitter