crwdns2933423:0crwdne2933423:0

crwdns2933803:06crwdne2933803:0

crwdns2933797:0Arthur Shicrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Arthur Shi

crwdns2933769:0crwdne2933769:0
crwdns2933771:0crwdne2933771:0
crwdns2933801:0crwdne2933801:0

crwdns2933807:0crwdne2933807:0

[* black] Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile.
[* black] Here are the front-side chips:
- [* red] HiSilicon Kirin 955 (likely a HiSilicon Hi3650) Octa-Core Applications Processor layered underneath SK Hynix [https://www.skhynix.com/products.do?ct1=36&ct2=41&lang=eng|H9CKNNNDATMUQRN-UH|new_window=true] 24 Gb (3 GB) LPDDR3 RAM
+ [* red] HiSilicon Kirin 955 (likely a HiSilicon Hi3650) octa-core processor layered underneath 3 GB of SK Hynix [https://www.skhynix.com/products.do?ct1=36&ct2=41&lang=eng|H9CKNNNDATMUQRN-UH|new_window=true] LPDDR3 RAM
[* orange] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/emmc/KLMBG2JENB-B041?ia=2324|KLMBG2JENB-B041|new_window=true] 32 GB eMMC NAND flash memory
[* yellow] Texas Instruments [http://www.ti.com/product/BQ25892|BQ25892|new_window=true] fast charging IC
[* green] HiSilicon Hi6402 audio codec
- [* light_blue] Maxim Integrated MAX98925 Audio Amplifier
- [* blue] Altek AL6610-72M1 AI Camera Processor (likely)
+ [* light_blue] Maxim Integrated MAX98925 audio amplifier
+ [* blue] Altek AL6610-72M1 AI camera processor (likely)