crwdns2933803:06crwdne2933803:0
crwdns2933797:0Dinan Bluejecrwdnd2933797:0crwdne2933797:0
crwdns2936045:0crwdne2936045:0 crwdns2933505:0crwdne2933505:0 Adam O'Camb
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
| [* black] Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile. | |
| [* black] Here are the front-side chips: | |
| - | [* red] SKhynix [https://www.skhynix.com/products.do?ct1=36&ct2=41&lang=eng|H9CKNNNDATMU|new_window=true] 24 Gb (3 GB) LPDDR3 RAM |
| + | [* red] SKhynix [https://www.skhynix.com/products.do?ct1=36&ct2=41&lang=eng|H9CKNNNDATMU|new_window=true] 24 Gb (3 GB) LPDDR3 RAM Likely with Octa-Core processor layered underneath |
| [* orange] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/emmc/KLMBG2JENB-B041?ia=2324|KLMBG2JENB|new_window=true] 32 GB eMMC flash memory | |
| [* yellow] Texas Instruments [http://www.ti.com/product/BQ25892|BQ25892|new_window=true] fast charging IC | |
| [* green] HiSilicon Hi6402 audio codec |