crwdns2933803:07crwdne2933803:0
crwdns2933797:0Andrew Bookholtcrwdnd2933797:0crwdne2933797:0
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
| [* black] Shown here is a picture of the SiTime SI8002AC package with its outer protective casing removed. | |
| [* black] An ASIC to convert the raw signals of the oscillator is stacked on top of the oscillator itself, and the two are wire-bonded together for signal transfer. This entire unit is completely sealed inside the plastic outer package. | |
| [* black] The second picture is an X-Ray of a Bosch BMA 220 showing the stacked die configuration and wire bonds. | |
| + | [* black] Stacking dies allows chip manufacturers to pack more functionality on the same basic footprint. This is especially important in mobile devices such as the iPhone 4 where board space is at a minimum. |