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crwdns2933797:0Andrew Bookholtcrwdnd2933797:0crwdne2933797:0
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| + | [* black] Shown here is a picture of the SiTime SI8002AC package with its outer protective casing removed. |
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| + | [* black] An ASIC to convert the raw signals of the oscillator is stacked on top of the oscillator itself, and the two are wire-bonded together for signal transfer. This entire unit is completely sealed inside the plastic outer package. |
| + | [* black] The second picture is an X-Ray of a Bosch BMA 220 showing its stacked die configuration and the wire bonds connecting those dies both together and to the ball grid array. |
| + | [* black] Stacking dies allows chip manufacturers to pack more functionality on the same basic footprint. This is especially important in mobile devices such as the iPhone 4 where board space is at a minimum. |
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