crwdns2933803:010crwdne2933803:0
crwdns2933797:0Juan Luis Riveracrwdnd2933797:0crwdne2933797:0
crwdns2936045:0crwdne2936045:0 crwdns2933505:0crwdne2933505:0 Sam Goldheart
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
| - | [* |
|---|---|
| + | [* icon_note] What sorts of chips have been forged for the Fire Phone? Let's see: |
| [* red] Samsung K3QF2F200A-QGCE 16 Gb (2 GB) LPDDR3 RAM (we assume the 2.2 GHz quad-core Snapdragon 800 CPU with 450 MHz Adreno 330 GPU is layered underneath) | |
| [* orange] Samsung [https://chipworks.secure.force.com/catalog/ProductDetails?sku=SAM-KLMBG4GEAC-B001&viewState=DetailView&cartID=&g=|KLMBG4GEAC-B001|new_window=true] 32 GB eMMC NAND Flash | |
| [* yellow] Qualcomm [https://chipworks.secure.force.com/catalog/ProductDetails?sku=QUA-WCD9320&viewState=DetailView&cartID=&g=|WCD9320|new_window=true] audio codec | |
| [* green] Qualcomm [https://chipworks.secure.force.com/catalog/ProductDetails?sku=QUA-QFE2320&viewState=DetailView|QFE2320|new_window=true] multiband power amplifier | |
| [* blue] InvenSense [link|http://www.invensense.com/mems/gyro/mpu6500.html|MPU6500|new_window=true] (labeled as MP65 G266B1 L1351) | |
| [* violet] NXP [link|https://chipworks.secure.force.com/catalog/ProductDetails?sku=NXP-47803&viewState=DetailView&cartID=&g=|47803|new_window=true] NFC controller |