crwdns2933423:0crwdne2933423:0

crwdns2933803:011crwdne2933803:0

crwdns2933797:0alcs99crwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 alcs99

crwdns2933769:0crwdne2933769:0
crwdns2933771:0crwdne2933771:0
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crwdns2933807:0crwdne2933807:0

[title] Shielding and Thermal Paste Removal
[* black] The board level shielding was soldered to the board and required prying and breaking to reveal the chips.
+[* black] Once the board level shielding was removed, the silicone thermally conductive rubber was scraped away from the processor.