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| [* black] So what is a package? You're looking at one. | |
| [* black] This is a cross-section of the iPhone's ARM processor + RAM package. [http://www.ifixit.com/Misc/iphone_processor_crossection.jpg|Click here to see it in its full, 2854x313 glory.] | |
| [* black] The processor itself is the center rectangle. The silver circles underneath it are solder balls. | |
| - | [* black] The two rectangles above the processor are RAM dies.They are offset from each other to make room for the wirebonds, which you can't see in this shot. |
| + | [* black] The two rectangles above the processor are RAM dies. They are offset from each other to make room for the wirebonds, which you can't see in this shot. |
| [* black] Having the RAM so close to the processor both reduces latency—making RAM access faster—and cuts power consumption, helping your battery last longer. |