crwdns2936039:0Apple A4 Teardowncrwdnd2936039:02crwdne2936039:0

crwdns2933803:02crwdne2933803:0

crwdns2933797:0Walter Galancrwdnd2933797:0Dzi 5, 2010crwdne2933797:0

	[title] How to dissect a processor
	[* black] Back when the original iPhone came out, we worked with some friends of ours in Silicon Valley to dissect the processor. The equipment we used wasn't nearly as cutting-edge as what Chipworks uses, but it got the job done.
-	[* black] This is a silicon wafer. Each small square is a chip, called a die. The processor die in the A4 is 7.3 mm on each side, for 53 square mm total area. The percent of working dies that you can get from a wafer like this is called the *yield.*
+	[* black] This is a silicon wafer. Each small square is a chip, called a die. The processor die in the A4 is 7.3 mm on each side, for a 53 square mm total area. The percent of working dies that you can get from a wafer like this is called the *yield.*
	[* black] The A4 is actually much more than just a processor— it's a Package on Package, or PoP. In fact, there are three silicon dies inside the A4!