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| + | [title] How to dissect silicon |
|---|---|
| [* black] This is a silicon wafer. Each small square is a chip, actually called a die. The processor die in the A4 is 7.3 mm on each side, for 53 square mm total area. | |
| [* black] The A4 is actually much more than just a processor— it's a Package on Package, or PoP. There are actually three silicon dies inside the A4! | |
| [* black] The first two layers are RAM, manufactured by Samsung. Having the RAM so close to the processor both reduces latency—making RAM access faster—and cuts power consumption, helping your battery last longer. |