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| - | [* black] Grinding through the iPhone processor to take cross section photo. |
|---|---|
| + | [* black] There's only one way to get a nice cross-section photo of a processor like the one above: Cut into it. |
| + | [* black] Band saws are much too crude for this, so we actually grind through the processor slowly, taking off very small amounts of material as we go. |
| [* black] You can see why it can be tough to take a clear, solid photo of a package's cross-section. The processor is actually one of the larger packages in the iPhone, and still very finicky to handle. Imagine trying to do this with a package a tenth of its size. |