crwdns2936637:0crwdne2936637:0 crwdns2853008:0crwdne2853008:0 crwdns2918746:0crwdne2918746:0

crwdns2933803:014crwdne2933803:0

crwdns2933797:0Milena Haigescrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Milena Haiges

crwdns2933769:0crwdne2933769:0
crwdns2933771:0crwdne2933771:0
crwdns2933801:0crwdne2933801:0

crwdns2933807:0crwdne2933807:0

[* black] Remove the EMI shield from the logic board, and presto!
[* black] This board is markedly different than the [guide|2197|pre-production board] we uncovered.
[* black] Markings on the A4:
[* black] N26CGM0T 1007 APL0398 33950084 YNL184A2 1004 K4X2G643GE
[* black] Yes, the K4X2 is a Samsung DRAM part number!
- [* black] [link|http://www.samsung.com/global/business/semiconductor/products/dram/downloads/Mobile_SDR_DDR_code.pdf|Decoding] the part number shows there is 2Gb of memory inside. This translates into ~128MB of memory per die, for 256 MB total. (NOT 512MB, as we previously reported.)
+ [* black] Decoding the part number shows there is 2Gb of memory inside. This translates into ~128MB of memory per die, for 256 MB total. (NOT 512MB, as we previously reported.)
[* black] This means the A4 processor is probably being manufactured by Samsung.
[* black] The DRAM was stamped at the end of January, while the processor die was likely manufactured the third week of February.