crwdns2933803:014crwdne2933803:0
crwdns2933797:0Kyle Wienscrwdnd2933797:0crwdne2933797:0
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
[* black] Remove the EMI shield from the logic board, and presto! | |
- | [* black] This board is markedly different than the pre-production board we |
+ | [* black] This board is markedly different than the [guide|2197|pre-production board] we uncovered. |
[* black] Markings on the A4: | |
[* black] N26CGM0T 1007 APL0398 33950084 YNL184A2 1004 K4X2G643GE | |
[* black] Yes, the K4X2 is a Samsung DRAM part number! | |
- | [* black] [link|http://www.samsung.com/global/business/semiconductor/products/dram/downloads/Mobile_SDR_DDR_code.pdf|Decoding] the part number shows there is 2Gb of memory inside. This translates into ~ |
+ | [* black] [link|http://www.samsung.com/global/business/semiconductor/products/dram/downloads/Mobile_SDR_DDR_code.pdf|Decoding] the part number shows there is 2Gb of memory inside. This translates into ~128MB of memory per die, for 256 MB total. (NOT 512MB, as we previously reported.) |
[* black] This means the A4 processor is probably being manufactured by Samsung. | |
[* black] The DRAM was stamped at the end of January, while the processor die was likely manufactured the third week of February. |