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crwdns2933797:0Jack Lawrence Faragocrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Jack Lawrence Farago
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| + | [* black] Flip over the popped-off plate component (with the wires still connected to it) and use the soldering iron to burn off the adhesive glue protecting the innards of the device in this area |
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| + | [* icon_caution] The soldering iron is extremely hot. Please be careful when using it |
| + | [* black] With the soldering iron, go in a circular path around the underside of the component where the glue binds it together (the white lining) |
| + | [* black] The component should pop off after using it (a spudger might be needed to get more leverage when popping it off) |
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