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+[title] Remove part of the back plate
+[* icon_caution] The back plate is very fragile in some areas, so be careful when prying. These areas are the SIM slot, power and volume buttons, headphone jack, and camera bezel.
+[* black] Insert a shimmy tool in the SIM slot, into the edge of the plate, to create a gap. Then, insert a pick into the gap, and slide it across the edge of the phone, to unclip the plate.
+[* icon_caution] Do not try to unclip the part around the camera. We will save that for step 4.

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