crwdns2933803:06crwdne2933803:0
crwdns2933797:0Arthur Shicrwdnd2933797:0crwdne2933797:0
crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Arthur Shi
- crwdns2933769:0crwdne2933769:0
- crwdns2933771:0crwdne2933771:0
- crwdns2933801:0crwdne2933801:0
crwdns2933807:0crwdne2933807:0
- | [* black] Move the heat shrink to the solder area; completely cover the area. Using a heat source (i.e.,grill lighter), begin heating the middle of the solder area and slowly move towards the end of the soldier to the insulation. |
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- | [* black] The heat shrink acts as insulation for the wire. |
- | [* icon_note] The process should not exceed more than ten seconds. |
+ | [title] Cover the exposed solder joint |
+ | [* black] Slide the heat-shrink over the exposed solder joint so that it completely covers the joint and the surrounding insulation. |
+ | [* icon_note] The heat-shrink acts as insulation for the wire. |
+ | [* black] Wave a heat source (lighter or heat gun) over the heat-shrink material to activate it. Apply heat until the heat-shrink has shrunk securely around the solder joint. |