crwdns2936637:0crwdne2936637:0 crwdns2853008:0crwdne2853008:0 crwdns2918746:0crwdne2918746:0

crwdns2933803:06crwdne2933803:0

crwdns2933797:0Arthur Shicrwdnd2933797:0crwdne2933797:0

crwdns2936043:0crwdne2936043:0 crwdns2933505:0crwdne2933505:0 Arthur Shi

crwdns2933769:0crwdne2933769:0
crwdns2933771:0crwdne2933771:0
crwdns2933801:0crwdne2933801:0

crwdns2933807:0crwdne2933807:0

-[* black] Move the heat shrink to the solder area; completely cover the area. Using a heat source (i.e.,grill lighter), begin heating the middle of the solder area and slowly move towards the end of the soldier to the insulation.
- [* black] The heat shrink acts as insulation for the wire.
-[* icon_note] The process should not exceed more than ten seconds.
+[* black] Slide the heat-shrink over the exposed solder joint so that it completely covers the joint and the surrounding insulation.
+ [* icon_note] The heat-shrink acts as insulation for the wire.
+[* black] Wave a heat source (lighter or heat gun) over the heat-shrink material to activate it. Apply heat until the heat-shrink has shrunk securely around the solder joint.